Vulnerability
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
CISA description: “Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.”
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HLow exploitation likelihood — defer if no other signals fire.
No VEX statements published for CVE-2023-33063. Vendors publish VEX (Vulnerability Exploitability eXchange) to assert per-product whether a CVE is actually exploitable in their distribution.
Active exploitation with total impact on essential/support systems